| Title: | OS10-1 Intelligent Temperature Control System for Chip Soldering Station |
|---|---|
| Publication: | ICAROB2025 |
| Volume: | 30 |
| Pages: | 282-285 |
| ISSN: | 2188-7829 |
| DOI: | 10.5954/ICAROB.2025.OS10-1 |
| Author(s): | Huahao Li, Junjin Chen, Ce Bian, Mengfan Zhang |
| Publication Date: | February 13, 2025 |
| Keywords: | MCGS, Temperature Control, Siemens S7-200 PLC, PID |
| Abstract: | Chip is the general name of semiconductor component products, mainly by the semiconductor material, solid state electronic devices, silicon wafers and other materials processed through a number of responsible processes. According to the functional requirements, the intelligent temperature control system of the chip welding bench is designed with PLC as the control core. In the PLC system design using PID instructions, when the temperature is close to the specified temperature using low-power heating, when the temperature difference is large high-power heating. In this paper, we design the temperature control system of chip soldering bench with Siemens S7-200 PLC as the control core. |
| PDF File: | https://alife-robotics.co.jp/members2025/icarob/data/html/data/OS/OS10/OS10-1.pdf |
| Copyright: | © The authors. This article is distributed under the terms of the Creative Commons Attribution License 4.0, which permits non-commercial use, distribution and reproduction in any medium, provided the original work is properly cited. See for details: https://creativecommons.org/licenses/by-nc/4.0/ |
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