OS15-2 Wafer defect detection method based on machine vision

Title:	OS15-2 Wafer defect detection method based on machine vision
Publication:	ICAROB2020
Volume:	25
Pages:	795-799
ISSN:	2188-7829
DOI:	10.5954/ICAROB.2020.OS15-2
Author(s):	Chundong Zhao, Xiaoyan Chen, Dongyang Zhang, Jianyong Chen, Kuifeng Zhu, Yanjie Su
Publication Date:	January 13, 2020
Keywords:	machine vision, flood fill, defect detection, rotation correction
Abstract:	With the development of integrated electronic circuit manufacturing technology, enterprises have put forward higher requirements for the quality of silicon chips. Aiming at the low efficiency of silicon wafer defect detection, this paper proposes an automatic defect detection method based on machine vision. The voiding algorithm based on flood fill can effectively extract the inner contour information of the wafer profile. A rotation correction algorithm is proposed to correct the wafer yaw angle. The actual wafer was used to verify the performance of the proposed method. The results show that the proposed method is effective in detection accuracy.
PDF File:	https://alife-robotics.co.jp/members2020/icarob/data/html/data/OS/OS15/OS15-2.pdf
Copyright:	© The authors. This article is distributed under the terms of the Creative Commons Attribution License 4.0, which permits non-commercial use, distribution and reproduction in any medium, provided the original work is properly cited. See for details: https://creativecommons.org/licenses/by-nc/4.0/